SOLDER BARS AND ANODES

Our solder and tin anodes are processed for high density and fine grain structure, and are the highest quality anodes available to the printed circuit board industry. These solders are designed and engineered to meet Indian, British, German, Japanese and American specifications. A unique processing method used in manufacturing these anodes eliminates oxide and non-metallic inclusions, and provides uniform plating without sludging and flaking.

These solders can be used for general soldering applications as well as for critical microelectronic assemblies. They can be used in all types of automatic soldering machines, dip soldering equipment, tinning baths and all manual soldering processes. The anodes can be used to plate printed circuit board to extend the solderable shelf life and to use as an etch resist. They are also applicable for plating copper wire, bus bar as well as for plating terminals, eyelets and other electronic components. These solders and anodes are processed to assure fine grain structure and even dissolution during soldering or plating.

SOLDER PAINT

Hybrid # RAD 3400 Solder Paint is formulated for Reflow soldering of Radiators, Heat exchangers, Sheet Metal Soldering and automobile body patching applications.

Hybrid Solder Paint is a well-homogenised suspensions of solder particles in an active flux system. The solder used in manufacturing Hybrid Solder Paint is pre-alloyed before atomization to assure accurate melt ranges and qualify reliable wetting to the base metal surfaces. Hybrid Solder Paint offer dependability and economy. It can be used efficiently for mass soldering of radiators and heat exchangers.

Hybrid Solder Paint is normally applied by brush. Solder Paint can be melted and re flowed with any heat source. Soldering time and temperature are dependent on alloy composition and type of flux. Hybrid Solder Paint is available in a proprietary alloy composition suitable for these applications.

SOLDER WIRE
We manufacture solders in wire form, solid, single core and multi-core (up to five core) from 8mm to 26SWG in standard compositions. Cored solder wires are produced with various core percentages. They are available with non activated (R), mildly activated (RMA), fully activated (RA) and water soluble flux core. We also supply wires with acid core, urea core or any other type of flux core according to customer requirements. Advanced no-clean core wire up to 0.5mm diameter is also available upon request. The solder alloy composition, wire diameter, flux quality and percentage of flux in the wire is monitored and controlled to provide consistent results. Our solder wires are suitable for hand soldering of electronic assemblies. The very low impurity levels assure strong and clean solder joints of high reliability.

RMA RESIN FLUX CORE SOLDER WIRE
RMA type resin-core solder wire has been developed for use in electronics industry and meets the chemical and metallurgical requirements specified in various industry and international standards. Our RMA type resin flux used in manufacturing RMA flux cored solder wire is an extremely effective flux which provide very high reliability solder joint. The residue left after soldering is non-corrosive, moisture and fungus resistant and is considered to be non-conductive. The residue after soldering need not to be removed in most cases. This is a high reliability flux core solder wire and is suggested to be used in military, telecommunication, computer, aeronautics and other critical applications.

RA RESIN FLUX CORE SOLDER WIRE
RA type resin cored solder wire is available in all type of solder alloys, different sizes and varying core percentages. It is used for soldering any kind of electronic assemblies. It provides instant wetting and excellent capillary action which results in less rejections and few touch-ups. This type of wire is suitable for soldering oxidized and difficult to solder metals. The flux residue left after soldering is considered to be non-conductive non-hygroscopic and non-tacky, and can be removed by, solvent cleaning process.

WATER SOLUBLE FLUX CORE SOLDER WIRE
Water soluble core solder wire is an aggressive organic core solder specifically for soldering electronic assemblies, particularly applicable for use where acid core flux is too corrosive and rosin fluxes are too inactive. Water soluble core solder is suitable for soldering heavily oxidized metal surfaces. Water soluble core flux is an active flux and should be removed after hand soldering operation. The residue can be readily and completely removed with water or aqueous detergent cleaner.

NO-CLEAN FLUX CORE SOLDER WIRE

No-clean cored solder wire was developed to eliminate the use of solvents for post-solder cleaning of circuit board assemblies in electronic industry. The No-clean flux used in the wire core is completely halide-free and meets the requirements specified in Bell Core specification and J-STD-004. It provides excellent solderablity and high reliability. The flux residue requires no cleaning due to physico-chemical characteristics of the core flux.

SOLDER PASTE
Solder paste composition consists of high purity alloys homogeneously suspended in a flux system comprised of highest grade chemicals to provide a reflow system adaptable to microcircuit and surface mount production methods. The flux residue can be removed readily with solvent cleaners supplied by us. Solder pastes should be stored at controlled temperatures and the material should always be stirred slowly and uniformly prior to use. Solder Paste can be applied by screen printing, stenciling, dipping, brushing or with a syringe. Indirect and direct metal masks can also be used where good definition and/or thicker deposits are required. After paste application, components will remain tacky for up to 24 hours. Re-flow of solder paste can be accomplished with any heat source, such as a conveyor furnace, convection, hot air, infra-red radiation, vapour or induction heating. Peak re-flow temperatures should generally be 20°C to 50°C higher than the melting point of the alloy. Minimum soldering temperature and time should be utilized to obtain optimum results.

We supply solder pastes in varying degree of flux activities, with No-clean, rosin or acid flux bases, and in standard and special solder alloys. Tin / lead, tin / silver / lead and lead free alloys are supplied to meet Indian, British, German, Japanese and American specifications and specific customer requirements. Electronic grade solder pastes are supplied with varying viscosities and metal content.

PRODUCT NO	ALLOY COMPOSITION													COMMON REQUREMENTS				SOLIDUS	LIQUIDUS
	Sn	Pb	Ag	Bi	Cu								Zn	BAR	WIRE	PASTE	PAINT	°C	°C
1	5	95	-	-	-								-			-	-	308	312
2	5	93.5	1.5	-	-								-			-	-	287	296
3	10	90	-	-	-								-			-	-	275	302
4	10	88	2	-	-								-				-	267	299
5	15	85	-	-	-								-			-	-	183	288
6	20	80	-	-	-								-			-	-	183	280
7	25	75	-	-	-								-			-	-	183	268
8	30	70	-	-	-								-			-		183	257
9	40	60	-	-	-								-			-		183	238
10	43	43	-	14	-								-				-	144	163
11	49	51	-	-	-								-		-	-	-	183	216
12	50	50	-	-	-								-			-	-	183	212
13	60	40	-	-	-								-			-	-	183	191
14	62	36	2	-	-								-				-	179	179
15	62	38	-	-	-								-			-	-	182.7	183.3
16	63	37	-	-	-								-					183	183
17	65	35	-	-	-								-		-	-	-	183	192
18	70	30	-	-	-								-		-	-	-	183	193
19	75	25	-	-	-								-			-	-	183	194
20	75	-	-	-	-								25			-	-	-	MP 300
21	80	-	-	-	-								20	-	-	-	-	-	MP 280
22	80	20	-	-	-								-			-	-	183	199
23	95	5	-	-	-								-	-		-	-	183	222