AC 200 COPPER CLEANER
It is an aqueous acidic copper cleaner and conditioner formulated to remove chromate conversion film completely and microetch the copper surface. The fine grained uniform copper topography produced is ideal for dry film lamination hot air levelling and solder masking as well as for oxide coating and pattern plating. It can be used as the second step of a solder stripping process, to remove diffused intermetallic tin. It is an acid solution used for cleaning as the first step in production of a clean, micro etched copper surface during pre-clean operation. It will clean, deoxidise, remove light oils and micro etch bare copper PCBs. The etch rate is stable. It is particularly suitable for producing the correct topography and cleanliness for hot air levelling. It is non foaming and sprayable.

150 MG COPPER ETCHANT
It is a proven etchant, specially designed for etching copper in the manufacturing of printed circuit boards during mass production. MG Etchant chemicals are based on ammoniac compounds in highly selected proportions. It can be used in spray or immersion application.

1932 NICKEL CLEANER
It is an aquoues solution of acidic chemical components used to restore the solderability of nickel plated and nickel alloy surfaces. Tarnish can be removed by immersing the part for 15-20 seconds at room temperature. Immersion time can be reduced if the solution is warmed up to 74°C . After treatment the part should be thoroughly cleaned through hot water spray, followed by cold or hot water immersion.

6401 SOLDER STRIPPER
It is an acid based stripper designed to be used for stripping tin, tin / lead and lead from PCBs. It is extremely economical and will hold in excess of 15 oz. per gal. without replenishment. It contains a unique stabilizer, copper inhibitor system which reduces base metal etching during stripping.

6810 RESIST STRIPPER
It is a concentrated alkaline solution formulated specially to remove alkaline soluble dry films and silk screen printing inks from printed circuits boards. It contains no organic solvents and can be used in dip tanks and spray equipment.

8200 DE-FOAMER
It is an alkaline, non-silicon de-foamer (foam suppressant) used in conjunction with all alkaline resist stripper and developer solutions. It is recommended for use in conveyorised spray machines. It operates over a wide temperature range, which allows it to be used where necessary to control excessive foaming

6109 LACQUER
It is a fast drying resinous system designed to protect printed circuit boards and other electronic parts against oxidation. It protects and preserves the solderability of metallic surfaces and leaves a coating of resin that is completely compatible with almost all rosin base fluxes.

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